Heat Sink Compound importers in Manipur

Heat Sink Compound

Advanced thermal interface material designed to improve heat transfer between electronic components and heat sinks in power electronics and computing applications.

Thermal Conductivity:

High thermal conductivity formulation efficiently transfers heat from electronic components to heat dissipation surfaces.

Reduces operating temperatures and extends the service life of sensitive electronic devices and power components.

Electrical Isolation:

Non-conductive properties prevent electrical short circuits while maintaining excellent thermal transfer characteristics.

Safe for use on live circuits and components where electrical isolation is critical.

Easy Application:

Smooth, consistent viscosity allows for easy application and spreading across component surfaces.

Does not dry out or become brittle over time, maintaining thermal performance throughout product life.

Material Compatibility:

Compatible with various materials including aluminum, copper, ceramics, and semiconductor surfaces.

Non-corrosive formula prevents damage to components and maintains thermal interface integrity.

Aerosol Raw Material

Heat Sink Compound Importers In Manipur

Heat Sink Compound

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